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TU Berlin

Inhalt des Dokuments

Publications 2018

Books/Book chapters

Patents

Journal Articles

C. Schmidt and C. Kottke and R. Freund and F. Gerfers and V. Jungnickel (2018). Digital-to-analog converters for high-speed optical communications using frequency interleaving: impairments and characteristics. Optics Express, 6758-6770.


C. Schmidt and C. Kottke and V. Tanzil and R. Freund and V. Jungnickel and F. Gerfers (2018). Digital-to-Analog Converters Using Frequency Interleaving: Mathematical Framework and Experimental Verification. Circuits, Systems and Signal Processing, 1-26.


Conference Papers

S. Mortazavi and D. Schleicher and F. Schade and C. Gremzow and F. Gerfers (2018). Toward Investigation of the Multi-Gig Data Transmission up to 5 Gbps in Vehicle and Corresponding EMC Interferences. International Symposium on Electromagnetic Compatibility (EMC EUROPE). IEEE.


M. Runge and S. Linnhoff and F. Gerfers (2018). A Temperature and Process Corner Insensitive Design Method for Digital Circuits in 40nm CMOS. IEEE Int. Midwest Symp. on Circuits and Systems (MWSCAS). IEEE.


M. Runge and D. Schmock and P. Scholz and G. Boeck and F. Gerfers (2018). A 0.02-mm2 9-bit 100-MS/s Charge-Injection Cell Based SAR-ADC in 65-nm LP CMOS. ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference (ESSCIRC). IEEE, 26-29.


S. Mortazavi and D. Schleicher and F. Gerfers (2018). Modeling and verification of automotive Multi-Gig Ethernet communication up to 2.5 Gbps and the corresponding EMC analysis. IEEE Symposium on EMC+SIPI / Electromagnetic Compatibility + Signal & Power Integrity. IEEE, 329-334.


S. Mortazavi and D. Schleicher and F. Gerfers (2018). Characterization and Verification of Giganet ethernet-based bus systems in vehicles. IEEE International Symposium on Electromagnetic Compability; IEEE Asia-Pacific Symposium on Electromagnetic Compability. IEEE, 428-433.


N. Lotfi and M. Runge and F. Gerfers (2018). A MDAC Common-Mode Shifting Technique enabling Power Consumption Reduction in Pipeline ADCs. IEEE Int. Midwest Symp. on Circuits and Systems (MWSCAS). IEEE.


A. Dolinina and V. Lantsov and F. Gerfers (2018). Algorithm of nearest environment determination of the current state in piecewise model order reduction. IEEE Conf. of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus). IEEE, 188-193.


H. Ordouei and H. Ghafarian and F. Gerfers (2018). Analysis of Package Impedance Effects on the Linearity of Source Series Terminated DACs. IEEE Int. Midwest Symp. on Circuits and Systems (MWSCAS). IEEE.


M. Runge and F. Gerfers (2018). Correlation Based Time-Variant DAC Error Estimation in Continuous-Time ΣΔ ADCs With Pseudo Random Noise. IEEE Int. Symp. on Circuits and Systems (ISCAS). IEEE, 1-5.


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Head of Chair

Prof. Friedel Gerfers
Phone: +49 30 314-78181
Room: EN 423

Consultation hours:
by appointment only

Secretary's office Imke Weitkamp
Phone: +49 30 314-78180
Room: EN 417

Consultation hours:
Mo / Mi / Do: 14 - 16 Uhr
Di: 10 - 13 Uhr

Postal Address

Technische Universität Berlin
FG Mixed Signal Circuit Design
Sekr. EN 4
Einsteinufer 17

10587 Berlin
Germany