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Prof. Dr.-Ing. Friedel Gerfers

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Innovative Mixed Signal Circuit Design enables the Digital Future.

The mobile Internet access is the key technology revolutionizing our daily life in the last century. Thus, the unrestricted mobile access of our virtual digital media in the cloud from anywhere, or secure communication over networks with virtually unlimited bandwidth at home or from our mobile devices becomes increasingly important. These and similar technological challenges are addressed by Prof. Friedel Gerfers and his team through an interdisciplinary research program involving circuit design techniques, microprocessors, digital signal processing algorithms, semiconductor technologies, MEMS devices etc. The Company NiederRhein Technologies (California, USA), founded by Prof. Gerfers in 2009, focused on kin problems. Since January 2015, Prof. Gerfers heads the "Mixed Signal Circuit Design (MSC)" department at the Faculty IV Electrical Engineering and Computer Science at the Berlin Institute of Technology, which is connected to a W3 professorship. Born on the Lower Rhine in Rheinberg, he studied microelectronics at the University of Duisburg-Essen and obtained his Dr.-Ing. Degree from the Institute for Microsystems Technology (IMTEK), Albert-Ludwigs University of Freiburg. He gained his first industrial R&D experience at Philips Semiconductor (nowadays NXP), Starnberg, Germany. In 2006, he joined Intel Research in Santa Clara, USA as post-doctoral research fellow working on new types of piezoelectric MEMS sensors and their readout circuits. His entrepreneurial spirit led him in the years 2007 to 2011 to the start-up companies Alvand Technologies and Aquantia (both USA). In the role of a technical director, he led the mixed-signal departments, which were crucial for the successful market positioning of these companies in the field of high-speed data transmission systems that operate close to the Shannon limit. Most recently, he was responsible for the worldwide development of high-precision analog-to-digital converters for Integrated Device Technology (IDT), USA. The team was later in 2014 acquired by Apple Inc. Due to his broad expertise Prof. Gerfers was appointed to the Advisory Board of Mentor Graphics Inc. and served from 2009-2014 on the Advisory Board of Berkeley Design Automation Inc., USA. Prof. Gerfers is a senior member of the IEEE and VDE and served on several technical program committees in the field of Solid-State Circuits and Systems. Prof. Gerfers is author of the book "Continuous-Time Sigma-Delta A/D conversion, Fundamentals, Error Correction and Robust Implementations".

Research Topics

The field of application spans from high-speed GS/s integrated circuits (IC) for wireless infrastructure applications (such as LTE base-stations), over energy-efficient DSP-based transceivers for optical applications (such as Silicon Photonics) to ultra-low power readout systems for optical and biomedical sensor as well as the design of ultra-robust automotive integrated circuits. Energy-efficient (RF-) transceiver architectures, energy harvesting approaches for mobile/hand-held devices and the large field of Internet-of-Things (IoT) technologies are additional key research topics.

• Data conversion techniques with an emphasis on robustness, energy efficiency as well as silicon area / cost reduction

• Low-power wideband wireline- & wireless transceiver, low-noise sensor readout

• Mixed-signal error- and mismatch estimation algorithms, (self)-adaptive calibration techniques and highly scalable DSP-based design techniques

• Semiconductor design flow, design automation as well as CAD tool development down to 14nm FinFet technologies.

 

 

 

 

 

 

 

Publications

P. J. Artz and P. Scholz and T. Mausolf and F. Gerfers (2022). A Fully-Differential 146.6-157.4 GHz LNA Utilizing Back Gate Control to Adjust Gain in 22 nm FDSOI. IEEE MTT-S International Microwave Symposium (IMS). IEEE.


P.J. Artz and F. Gerfers (2022). 6G D-Band Receiver Model with High Spectral Efficiency Enabling Global System Optimization. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS). IEEE.


P.J. Artz and J. Edler and E. Wittenhagen and N. Lotfi and F. Gerfers (2022). Workshop WM02 talk: High-Speed ADC (>20 GS/s) with High Resolution (≥10 bit) for Low-IF Receiver in 22nm FDSOI. IEEE European Microwave Week (EuMW) 2021


J. Edler and P.J. Artz and F. Gerfers (2022). Workshop WM02 talk: mm-Wave Advanced-Sampling Transceiver Enabling 6G Data Transmission with 100 Gbit/s per mobile User. IEEE European Microwave Week (EuMW) 2021


U. Hecht and E. Wittenhagen and H. Cirit and S. Behtash and S. Venkataram and F. Gerfers (2022). PAM-4/6/8 Performance and Power Analysis for Next Generation 224Gbit/s Links. IEEE International Symposium on Circuits and Systems (ISCAS). IEEE.


P. Kurth and K. Misselwitz and P. Scholz and U. Hecht and F. Gerfers (2022). A 0.007 mm2 48 - 53 GHz Low-Noise LC-Oscillator using an Ultra-Compact High-Q Resonator. 14th German Microwave Conference (GeMiC). IEEE, 104-107.


H. Ordouei and S. Waldmann and F. Gerfers (2022). In-Vehicle Network Standards - Overview and Implementation Examples. IEEE International Symposium on Circuits and Systems (ISCAS). IEEE.


S. Shivapakash and H. Jain and O. Hellwich and F. Gerfers (2021). A Power Efficiency Enhancements of a Multi-Bit Accelerator for Memory Prohibitive Deep Neural Networks. IEEE Open Journal for Circuits and Systems, 161-170.


H. Ghafarian and S. Shivapakash and S. Mortazavi and P. Scholz and N. Lotfi and F. Gerfers (2021). A 9-bit, 45mW, 0.05mm2 Source-Series-Terminated DAC Driver with Echo Canceller in 22nm CMOS for In-Vehicle Communication. IEEE Solid State Circuit Letters, 10-13.


M. Runge and J. Edler and T. Kaiser and F. Gerfers (2021). A 18MS/s 76dB SNDR 93dB SFDR CT ΔΣ Modulator with Input Voltage Tracking 2nd-Order GmVC Filter and Shared FIR DAC in 22nm FDSOI CMOS. IEEE Custom Integrated Circuits Conference 2021. IEEE.


M. Runge and D. Schmock and T. Kaiser and F. Gerfers (2021). A 0.9V 45MS/s CT ΔΣ Modulator with 94dB SFDR and 25.6fJ/conv. enabled by a Digital Static and ISI Calibration in 22 FDSOI CMOS. IEEE Custom Integrated Circuits Conference 2021. IEEE.


S. Shivapakash and S. Wiedemann and D. Becking and P. Wiedemann and W. Samek and F. Gerfers and T. Wiegand (2021). FantastIC4: A Hardware-Software Co-Design Approach for Efficiently Running 4bit-Compact Multilayer Perceptrons. IEEE Open Journal for Circuits and Systems


E. Wittenhagen and P. Artz and P. Scholz and F. Gerfers (2021). A 3 GS/s >55 dBFS SNDR Time-Interleaved RF Track and Hold Amplifier with >67 dBc SFDR up to 3 GHz in 22FDX. IEEE Radio Frequency Integrated Circuits Symposium (RFIC). IEEE, 139-142.


J. Edler and M. Runge and F. Gerfers (2021). A Dynamic Body-Bias Linearization Technique Enabling Wide-Band GmC based Continous-Time Sigma-Delta Converters in 22 nm FD-SOI CMOS. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS). IEEE, 1090-1093.


E. Wittenhagen and M. Runge and N. Lotfi and H. Ghafarian and Y. Tian and F. Gerfers (2021). Advanced Mixed Signal Concepts Exploiting the Strong Body-Bias Effect in CMOS 22FDX®. IEEE Transactions on Circuits and Systems I: Regular Papers, 57-66.


P. Kurth and U. Hecht and E. Wittenhagen and F. Gerfers (2021). A Divider-less Automatic Frequency Calibration for Millimeter-Wave Sub-Sampling Phase-Locked Loops. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS). IEEE, 718-721.


P. Kurth and K. Misselwitz and U. Hecht and F. Gerfers (2021). A 56 GHz 19 fs RMS-Jitter Sub-Sampling Phase-Locked Loop for 112 Gbit/s Transceivers. IEEE International Symposium on Circuits and Systems (ISCAS). IEEE, 1-5.


T. Kaiser and F. Gerfers (2020). Towards pW-Class IoT Nodes using Crystalline Oxide Semiconductor Dynamic Logic. International Symposium on Circuits and Systems (ISCAS). IEEE.


S. Wiedemann and S. Shivapakash and P. Wiedemann and D. Becking and W. Samek and F. Gerfers and T. Wiegand (2020). FantastIC4: A Hardware-Software Co-Design Approach for Efficiently Running 4bit-Compact Multilayer Perceptrons. ArXiV


B. Deutschmann and M. Giese and A. Jacob and N. Lotfi and F. Gerfers and S. Vehring and G. Böck (2020). PolyData/DataRace – Polymer-Integrated CMOS-Based High-Speed Communication Systems at W-Band. Wireless 100 Gbps and beyond : architectures, approaches and findings of German Research Foundation (DFG) priority programme SPP1655. IHP GmbH, 397-444.


N. N. Ledentsov and V.A. Shchukin and V.P. Kalosha and N. Ledentsov and L. Chorchos and J. P. Turkiewicz and U. Hecht and P. Kurth and F. Gerfers and J. Lavrencik and S. Varughese and S. E. Ralph (2020). Optical Interconnects Using Single-Mode and Multi-Mode VCSEL and Multi-Mode Fiber. Optical Fiber Communication Conference (OFC) 2020. Optical Society of America, M3D.1.


U. Hecht and N. Ledentsov and Ł. Chorchos and P. Kurth and N. N. Ledentsov and F. Gerfers (2020). Up to 30-Fold BER Improvement Using a Data-Dependent FFE Switching Technique for 112Gbit/s PAM-4 VCSEL Based Links. Optical Fiber Communication Conference (OFC) 2020. Optical Society of America, T3I.6.


N. Ledentsov and L. Chorchos and O. Makarov and J.-R. Kropp and V. Shchukin and V. P. Kalosha and U. Hecht and P. Kurth and F. Gerfers and J. P. Turkiewicz and N. N. Ledentsov (2020). Oxidation stress induced birefringence in vertical cavity surface emitting lasers. Vertical-Cavity Surface-Emitting Lasers XXIV. SPIE, 107 – 114.


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Head of Chair

Prof. Friedel Gerfers
Phone: +49 30 314-78181
Room: EN 423

For consultation hours, please contact us via e-mail.

Assistant to Chair
Sara Tennstedt
Room: EN 417
Phone: +49 30 314-78180

sekr@msc.tu-berlin.de

Currently no open office hours - please contact us via e-mail or phone in advance. Thank you.

Postal Address

Technische Universität Berlin
FG Mixed Signal Circuit Design
Sekr. EN 4
Einsteinufer 17

10587 Berlin
Germany