Mixed Signal Circuit Design

Patrick Artz, MSc.

 

 

 

Patrick Artz

Wiss. Mitarbeiter

artz@tu-berlin.de

+49 30 314 78183

Einrichtung Mixed Signal Circuit Design
Sekretariat EN4
Gebäude E-N
Raum E-N 410

Research Assistant

Research Interests

  • Mixed Signals:  
    • High-Resolution RF-ADCs with focus on Pipeline & SAR architectures
    • Time-Interleaving mismatch calibration
  • RF/mmW:   
    • Low/Zero-IF receiver design
    • Low Noise Amplifiers 

Publikationen

2023

Wittenhagen, E.; Artz, P.; Kurth, P.; Linnhoff, S.; Buballa, F.; Scholz, P.; Gerfers, F.
A Bulk-Controlled 12 GS/s Track and Hold Amplifier with >58 dBc SFDR and >53.5 dB SNDR in 22 nm FD-SOI CMOS
18th European Microwave Integrated Circuits Conference (EuMIC)
Herausgeber: IEEE
2023

2022

Artz, P.J.; Gerfers, F.
6G D-Band Receiver Model with High Spectral Efficiency Enabling Global System Optimization
IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
Herausgeber: IEEE
2022
Wittenhagen, E.; Artz, P.; Scholz, P.; Gerfers, F.
A 3 GS/s RF Track-and-Hold Amplifier Utilizing Body-Biasing with >55 dBFS SNR and >67 dBc SFDR up to 3 GHz in 22 nm CMOS SOI
IEEE Open Journal for Circuits and Systems
2022
OpenAccess
Artz, P. J.; Scholz, P.; Mausolf, T.; Gerfers, F.
A Fully-Differential 146.6-157.4 GHz LNA Utilizing Back Gate Control to Adjust Gain in 22 nm FDSOI
IEEE MTT-S International Microwave Symposium (IMS)
Herausgeber: IEEE
2022
Artz, P.J.; Edler, J.; Wittenhagen, E.; Lotfi, N.; Gerfers, F.
Workshop WM02 talk: High-Speed ADC (>20 GS/s) with High Resolution (≥10 bit) for Low-IF Receiver in 22nm FDSOI
IEEE European Microwave Week (EuMW) 2021
2022
Edler, J.; Artz, P.J.; Gerfers, F.
Workshop WM02 talk: mm-Wave Advanced-Sampling Transceiver Enabling 6G Data Transmission with 100 Gbit/s per mobile User
IEEE European Microwave Week (EuMW) 2021
2022

2021

Wittenhagen, E.; Artz, P.; Scholz, P.; Gerfers, F.
A 3 GS/s >55 dBFS SNDR Time-Interleaved RF Track and Hold Amplifier with >67 dBc SFDR up to 3 GHz in 22FDX
IEEE Radio Frequency Integrated Circuits Symposium (RFIC), Seite 139-142
Herausgeber: IEEE
2021

2019

Zhao, Zhixing; Lehmann, Steffen; Lucci, Luca; Andee, Yogadissen; Divay, Alexis; Pirro, Luca; Herrmann, Tom; Zaka, Alban; Sousa, Ricardo; Artz, Patrick James; Hempel, Klaus; Faul, Juergen; Chen, Tianbing; Taylor, Richard; Mazurier, Jerome; Grass, Carsten; Hoentschel, Jan; Harame, David
22FDX® fMAX Optimization through Parasitics Reduction and GM Boost
IEEE European Solid-State Device Research Conference (ESSDERC)
Herausgeber: IEEE
2019